Principal Optical Engineer
Core
Define multi-generation architectures and guide technologies for near-package optics (NPO), co-packaged optics (CPO), and silicon photonics used in hyperscale AI systems.
Role type
Principal IC optical engineer (silicon photonics & advanced packaging)
Builds
NPO and CPO optical interconnects for AI scale-up networks
Domain
Semiconductor industry + silicon photonics
Required skills
silicon photonics architecture, NPO/CPO design, optical engine design, advanced packaging (chiplets, 2.5D/3D), heterogeneous integration, link budget modeling, failure analysis, supply chain management, industry standards influence
Preferred skills
VCSEL expertise, high-speed electrical test equipment proficiency, AI infrastructure experience (GPU fabrics, InfiniBand, NVLink), foundry/OSAT collaboration
Technologies
Silicon photonics, VCSELs, modulators (MRM/MZM), photodetectors, waveguides, flip-chip, hybrid bonding, 2.5D/3D integration
Responsibilities
Define system models connecting photonic-device performance to network-level performance; lead laboratory characterization and debug including link bring-up and failure analysis; drive technical alignment across silicon, packaging, thermal, and networking teams; set technical direction with foundries and suppliers; mentor engineers and communicate architectural decisions to leadership
Seniority
Principal, hands-on IC with strategy & mentorship
