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Senior Quantum Package & Motherboard Engineer

United States, Washington, Redmond💼 Full-time🗓 2026-06-23 → 2026-07-23

Core

Develop and maintain robust Package & Motherboard design processes for quantum devices, including PCB design, signal/power integrity simulation, and supply chain management for cryogenic solutions.

Role type

Senior IC Quantum Package & Motherboard Engineer

Builds

Cryogenic quantum device packaging and motherboards

Domain

Quantum computing hardware / Cryogenic electronics

Deliverable

production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work

Required skills

Quantum device packaging design, PCB design, Signal Integrity simulation, Power Integrity simulation, Analog layout, Supply chain management, Manufacturing readiness processes, AI tool application for layout acceleration, Vendor management, Design for manufacturing (DFM), Testability analysis

Preferred skills

Experience with superconducting integrated circuit design teams, Experience with electronics manufacturing services (EMS/CMs), AI-first development environment proficiency

Technologies

PCB design tools, Signal Integrity simulation tools, Power Integrity simulation tools, AI tools for analog layout

Responsibilities

Design and drive external packaging material vendors to leverage existing supply chains, Design and drive PCB designs for cryo/quantum solutions, Simulate Packaging/Motherboard components for Signal & Power Integrity, Own signaling chain specifications from Room-Temperature to Cryo/Quantum temperature logic, Develop and improve electrical and PCB development processes and quality frameworks, Apply AI to accelerating Analog Layout execution times

Seniority

Senior, hands-on IC

Rewrite
## About the role - Develop and maintain robust Package & Motherboard design processes for quantum devices. - Document processes and implement across our global team. - Design & drive external packaging material vendors to leverage existing supply chains to deliver solutions needed for packaging of quantum devices. - Design & drive PCB designs to deliver solutions needed for cryo/quantum solutions. - Simulate Packaging/Motherboard components for Signal & Power Integrity. - Own signaling chain - including specifications, material / connector / cable definition from Room-Temperature to Cryo/Quantum temperature logic. - Develop and improve electrical and PCB development processes, documentation, quality frameworks, design review practices, design for manufacturing, testability, and validation workflows, manufacturing readiness processes, dashboards, and reporting mechanisms. - Apply AI to accelerating Analog Layout execution times - Apply AI to accelerating Analog Layout execution times ## Requirements - Doctorate in Physics, Engineering, or related field AND 1+ year(s) experience in industry or in a research and development environment, could include completion of a post doctoral research position - OR Master's Degree in Physics, Engineering, or related field AND 4+ years experience in industry or in a research and development environment - OR Bachelor's Degree in Physics, Engineering, or related field AND 6+ years experience in industry or in a research and development environment - OR equivalent experience. - Ability to leverage artificial intelligence (AI) tools to drive innovation and efficiency (e.g., measurement, performance modeling and analysis, research gathering, day-to-day task automation). - Ability to work in an "AI-first" environment using modern AI tools to accelerate discovery through hardware development. - Bachelors or Masters Degree in Electrical Engineering or related field. - 10+ years design experience in Silicon Package Design and PCB Design. - Successfully delivered Silicon Packages and Motherboards into production. - Knowledge of industry standard tools/methodologies for Package and PCB Design. - Proficient in Analog Signal, Power Integrity & Signal Integrity simulations. - Self-starter with the ability to define and adhere to a schedule. - Good inter-personal skills, able to interface with a variety of external partners (customers, architects, designers, project managers, etc.) and are able to deliver complete layouts to customers. - Experience working directly with PCBs and/or superconducting integrated circuit design teams, fabrication vendors, electronics manufacturing services and contract manufacturers (EMS/CMs), and external suppliers. - Experience working directly with PCBs and/or superconducting integrated circuit design teams, fabrication vendors, electronics manufacturing services and contract manufacturers (EMS/CMs), and external suppliers.
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