Senior Quantum Package & Motherboard Engineer
Core
Develop and maintain robust Package & Motherboard design processes for quantum devices, including PCB design, signal/power integrity simulation, and supply chain management for cryogenic solutions.
Role type
Senior IC Quantum Package & Motherboard Engineer
Builds
Cryogenic quantum device packaging and motherboards
Domain
Quantum computing hardware / Cryogenic electronics
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Quantum device packaging design, PCB design, Signal Integrity simulation, Power Integrity simulation, Analog layout, Supply chain management, Manufacturing readiness processes, AI tool application for layout acceleration, Vendor management, Design for manufacturing (DFM), Testability analysis
Preferred skills
Experience with superconducting integrated circuit design teams, Experience with electronics manufacturing services (EMS/CMs), AI-first development environment proficiency
Technologies
PCB design tools, Signal Integrity simulation tools, Power Integrity simulation tools, AI tools for analog layout
Responsibilities
Design and drive external packaging material vendors to leverage existing supply chains, Design and drive PCB designs for cryo/quantum solutions, Simulate Packaging/Motherboard components for Signal & Power Integrity, Own signaling chain specifications from Room-Temperature to Cryo/Quantum temperature logic, Develop and improve electrical and PCB development processes and quality frameworks, Apply AI to accelerating Analog Layout execution times
Seniority
Senior, hands-on IC
