Gruppenleitung: Etch Integration (all genders)
Core
Leading a team developing robust and scalable dry etch and structuring processes for FEOL, BEOL, and Advanced-CMOS applications in 300mm wafer semiconductor manufacturing.
Role type
Senior IC process integration group leader (semiconductor)
Builds
Dry etch and structuring processes for FEOL, BEOL, and Advanced-CMOS applications
Domain
Semiconductor manufacturing / Nanoelectronics
Required skills
Dry etch process development and integration, FEOL/BEOL process integration, Advanced-CMOS integration, Plasma-assisted etch processes, 300mm wafer process experience, Team leadership, Project management, Client acquisition, Strategic planning
Preferred skills
Lithography, Hard mask systems, Thin film processes, Wet etch processes, Strategic roadmap development
Technologies
300mm wafer tools, Plasma etch systems, Lithography systems, Hard mask systems
Responsibilities
Provide technical and disciplinary leadership to the team, Drive innovative dry etch and structuring process development, Coordinate cross-process integration with lithography and thin film teams, Manage complex client requests and secure industrial funding, Develop group strategy and technology roadmaps, Represent the group to management and external partners