CareerPlan

Prozessingenieur Schleifen (m/w/x)

Wetzlar, DEFull-time2026-11-03 → 2026-11-10

Core

Develop new grinding processes for optical components in semiconductor manufacturing equipment and support production teams.

Role type

Process Engineer (Grinding)

Builds

High-precision lithography optics and process control solutions for semiconductor manufacturing

Domain

Semiconductor manufacturing equipment / Optical engineering

Required skills

Grinding process development, Optical component manufacturing, Production process management, Supplier negotiation, Cost-benefit analysis, Project planning

Preferred skills

Second level support, Strategic planning, Stakeholder mediation

Technologies

Grinding machines, Lithography optics, Process control systems

Responsibilities

Develop new grinding methods for optical components, Support production teams as second-level support, Ensure manufacturing suitability of new equipment, Create cost-benefit analyses for new technologies, Monitor project progress for process introductions

Seniority

Mid-Senior, hands-on IC