CareerPlan

Prozessingenieur Schleifen (m/w/x)

Wetzlar, DEFull-time2026-11-03 → 2026-11-14

Core

Develop new grinding processes for optical components in semiconductor manufacturing equipment and support production teams.

Role type

Process Engineer (Grinding)

Builds

High-precision lithography optics and process control solutions for semiconductor chips

Domain

Semiconductor manufacturing equipment / Optical engineering

Required skills

Grinding process development, Optical component manufacturing, Production process management, Cost-benefit analysis, Project planning, Supplier negotiation

Preferred skills

Second level support, Strategic planning, Stakeholder mediation

Technologies

Grinding machines, Lithography optics, Process control systems