半導体製造装置部門アプリケーションエンジニア(SFS/Nagoya)
Core
Field Application Engineer optimizing and validating 3D Tomography FIB/SEM solutions for semiconductor labs and manufacturing facilities.
Role type
Field Application Engineer (FAB/SEM)
Builds
3D Tomography FIB/SEM solutions for semiconductor manufacturing
Domain
Semiconductor manufacturing / Precision instrumentation
Required skills
SEM imaging, FIB-SEM sample preparation, Semiconductor manufacturer experience, English communication, Japanese communication, Driver's license
Preferred skills
Material analysis tools (EDS, EBSD, Cryo), Semiconductor device analysis (DRAM/NAND), 3D Tomography experience, DOE/SPC, Master's/PhD in Engineering/Physics/Chemistry/Materials Science
Responsibilities
Coordinate technical reviews and discussions with customers, Provide on-site technical support and troubleshooting, Conduct customer acceptance testing and demonstrations, Train customers on application usage, Collaborate with internal R&D teams, Travel 50%+ to US/Korea/Japan
Seniority
Mid-Senior, Hands-on IC