CareerPlan

(Sr.) Process Integration Engineer - Dry Etching GaN (m/f/d)

Hamburg, HAMBURGFull-time2026-09-09 → 2026-10-21

Core

Develop new wafer fab process modules on dry etching tools for GaN HEMT wafers, including passivation, metal-etching, and plasma clean.

Role type

Senior IC process integration engineer (dry etching)

Builds

Wafer fab process modules for GaN HEMT devices

Domain

Semiconductor manufacturing / GaN technology

Required skills

Dry etching tool operation, GaN HEMT wafer processing, process development, process integration, project leadership, technical knowledge of semiconductor devices, industrial semiconductor technology

Preferred skills

Lithography equipment experience, PC&O process improvement team participation

Technologies

Dry etching tools, GaN HEMT wafers

Responsibilities

Develop new wafer fab process modules on dry etching tools for GaN HEMT wafers, Execute process development or integration tasks and build up product and process knowledge, Lead small or medium sized process integration or optimization projects, Sub-project leader of process development or integration tasks in complex projects, Build up and maintain knowledge (technical & procedures) and BG internal & external contacts in own field of expertise, Be an active member in PC&O Process improvement teams

Seniority

Senior, hands-on IC