Postdoctoral Research Associate/Fellow in Advanced Semiconductor Packaging and mmWave/Terahertz Imaging System Integration
Core
Design, develop, and integrate next-generation microwave and radio frequency systems for microelectronics and semiconductor packaging.
Role type
Postdoctoral Research Associate/Fellow (IC Researcher)
Builds
High-frequency RF, millimetre-wave, and terahertz hardware systems and imaging platforms
Domain
Semiconductor packaging, mmWave/Terahertz imaging, RF engineering
Required skills
Electromagnetic modelling, circuit simulation, RF hardware design, semiconductor device integration, experimental validation, laboratory testing, system-level integration
Preferred skills
Bare-die integration, antenna-in-package (AiP), system-in-package (SiP), millimetre-wave/terahertz hardware development, student supervision, project leadership
Technologies
Keysight ADS, CST Studio Suite, Ansys HFSS
Responsibilities
Design advanced semiconductor packaging solutions, undertake electromagnetic modelling and circuit simulation, develop and validate high-frequency hardware systems, conduct laboratory testing and characterisation, collaborate with industry partners, contribute to research publications and student supervision
Seniority
Postdoctoral (Early-career IC)