Senior/Staff Advanced Packaging Materials Engineer, Texas Institute for Electronics
Core
Develop new formulations and evaluate materials for advanced semiconductor packaging products, including 2.5D/3D integration and hybrid bonding.
Role type
Senior/Staff IC materials engineer (advanced packaging)
Builds
Advanced packaging materials and solutions for semiconductor manufacturing
Domain
Semiconductor manufacturing / Advanced packaging
Required skills
Polymer chemistry, material formulation, Design of Experiments (DOE), materials characterization (DSC, TGA, DMA, FTIR, TMA), root-cause analysis, process optimization, interfacial science, thermal and mechanical properties analysis
Preferred skills
PhD in Materials Science, experience with Temporary Bonding and Debonding (TBDB) materials, startup or R&D environment experience
Technologies
DSC, TGA, DMA, FTIR, TMA, DOE methodologies
Responsibilities
Drive material formulation and process optimization via DOE; Design and execute experiments for material property evaluation; Lead material qualification and performance validation; Collaborate with cross-functional teams to integrate materials into packaging processes; Serve as technical subject matter expert for customers and partners
Seniority
Senior/Staff, hands-on IC