Senior/Staff Advanced Packaging Materials Engineer, Texas Institute for Electronics
Core
Develop new formulations and evaluate materials for advanced semiconductor packaging products, including 2.5D/3D integration and hybrid bonding.
Role type
Senior/Staff Materials Engineer (Advanced Packaging)
Builds
Material candidates and potential material-based solutions for semiconductor packaging
Domain
Semiconductor manufacturing / Advanced Packaging
Required skills
Polymer chemistry, material formulation, Design of Experiments (DOE), materials characterization (DSC, TGA, DMA, FTIR, TMA), root-cause analysis, process optimization, interfacial science, thermal and mechanical properties analysis
Preferred skills
PhD in Materials Science, experience in Temporary Bonding and Debonding (TBDB), startup or R&D environment experience
Technologies
DSC, TGA, DMA, FTIR, TMA
Responsibilities
Drive material formulation and process optimization; Design and execute experiments to evaluate material properties and reliability; Lead material qualification and performance validation; Collaborate with cross-functional teams to integrate new materials; Serve as technical subject matter expert for customers and suppliers
Seniority
Senior/Staff, hands-on IC