Manufacturing Operations Leader, Texas Institute for Electronics
Core
Lead end-to-end manufacturing operations of a semiconductor advanced packaging fabrication facility, ensuring safe, disciplined, and high-yield production.
Role type
Senior IC Manufacturing Operations Manager (Semiconductor Advanced Packaging)
Builds
Semiconductor logic, memory, and heterogeneous integration chips via advanced packaging processes
Domain
Semiconductor manufacturing / Advanced packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Wafer lot start planning, Cleanroom operations management, Material flow and logistics, Spares and inventory control, Lean Six Sigma and SPC, Yield management, AMHS operation, Root cause analysis (8D, FMEA), OEE and MTBF analysis, Cost optimization
Preferred skills
Cross-functional collaboration, Data-driven problem solving, Organizational and documentation skills
Technologies
AMHS, MES, ERP systems
Responsibilities
Manage master wafer start plan and daily execution cadence to achieve output metrics; Ensure shift staffing alignment and cleanroom/gown room readiness; Drive seamless lot movement with zero wafer loss; Maintain spares availability and optimized inventory levels; Lead continuous improvement initiatives for cycle time and predictability.
Seniority
Senior, hands-on IC
