Manufacturing Operations Leader, Texas Institute for Electronics
Core
Lead end-to-end manufacturing operations of a semiconductor advanced packaging fabrication facility, ensuring wafer lot starts, cleanroom readiness, material flow, and workforce execution.
Role type
Senior Manufacturing Operations Manager (Semiconductor Advanced Packaging)
Builds
Semiconductor logic, memory, and heterogeneous integration chips via advanced packaging
Domain
Semiconductor manufacturing / Advanced packaging
Required skills
Semiconductor FAB operations, Advanced packaging, Wafer lot control, Cleanroom management, Material flow logistics, Spares and inventory management, Lean/Six Sigma, SPC and yield management, AMHS systems, MES logic, Root cause analysis (8D, FMEA), OEE/MTBF/MTTR analysis, ESD and contamination control
Preferred skills
Bachelor's degree in engineering or science, Cross-functional collaboration, Data-driven problem-solving, Strong organizational skills
Technologies
AMHS, MES, ERP, LinkedIn Learning
Responsibilities
Manage master wafer start plan and daily execution cadence to achieve output and delivery metrics; Ensure shift staffing alignment and gown room readiness for all shifts; Drive seamless lot movement with zero wafer loss and minimize contamination risks; Manage spares availability and inventory optimization for tool uptime; Lead continuous improvement initiatives (Lean, Six Sigma, SPC) and apply root cause analysis to recurring issues.
Seniority
Senior, hands-on IC