Postdoctoral Fellow - DD
Core
Conduct and lead applied and fundamental research in physics-informed AI/ML methodologies to enable digital twin functionalities in microelectronics and advanced packaging.
Role type
Postdoctoral Researcher (Physics-informed AI/ML for Semiconductor Manufacturing)
Builds
Digital twin models for microelectronics and advanced packaging
Domain
Semiconductor manufacturing, advanced packaging, thermomechanics
Deliverable
production ML models
Required skills
Physics-informed AI/ML, multiscale and multiphysics modeling, thermomechanical analysis, advanced optimization and control, big data handling, Python, Matlab, Hadoop, Spark
Preferred skills
Co-optimization and co-control of multistage manufacturing systems, microelectronics packaging, heterogeneous integration
Technologies
Python, Matlab, Hadoop, Spark
Responsibilities
Develop multiscale and multiphysics modeling for thermomechanical effects on high performance heat spreaders; Collaborate with experimental groups on characterization of thermomechanical properties of diamond thin films and other thermal interface materials; Develop manuscripts for publishing in archival journals based on research results.
Seniority
Postdoctoral Fellow