Failure Analysis Engineer/Senior Failure Analysis Engineer, Texas Institute for Electronics
Core
Establish and manage surface science characterization tools for detailed failure analysis of complex 3D semiconductor packages to identify root causes and optimize processes.
Role type
Senior Failure Analysis Engineer (Semiconductor Manufacturing)
Builds
Advanced characterization facilities and metrology methodologies for 3D heterogeneous integration
Domain
Semiconductor manufacturing, advanced packaging, surface science
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Surface science characterization tools, facility setup and management, root cause analysis, process optimization, metrology development, cross-functional collaboration
Preferred skills
PhD in Materials Science/Physics/Mechanical Engineering, defense/commercial semiconductor experience, wafer-level assembly knowledge
Technologies
Surface science characterization tools, metrology equipment
Responsibilities
Establish and manage surface science characterization tools for advanced package failure analysis; Direct engagement in setting up characterization facilities including planning and procurement; Identify root cause of failures to enable process optimization; Collaborate with vendors and academic partners on advanced characterization techniques; Document design processes and establish Best Known Methodologies
Seniority
Senior, hands-on IC
