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热设计工程师(J84525)

上海市,深圳市💼 Full-time🗓 2026-07-21 → 2026-09-28

Core

Lead thermal design and simulation analysis from chip/package to board/system level for AI chips and servers, driving productization of new thermal technologies.

Role type

Senior IC thermal design engineer (AI chips & servers)

Builds

AI chips, servers, switchgear, and system racks

Domain

Semiconductor & Data Center Infrastructure

Deliverable

production ML models

Required skills

thermal simulation, heat transfer theory, fluid dynamics, thermal testing, ODM/OEM review, thermal platform development

Preferred skills

AI chip thermal design, liquid cooling, server/rack design, structural design

Technologies

thermal simulation software, thermal measurement tools

Responsibilities

Lead thermal design and simulation for AI chips from chip to system level; Develop and execute thermal testing plans; Support DVT/PVT and close loop thermal issues across engineering and production; Review and audit ODM/OEM thermal solutions and reports; Build and optimize thermal design platforms and simulation models; Explore and productize new thermal technologies and materials.

Seniority

Senior, hands-on IC

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