Director - Field Application Engineering (APAC)
Core
Lead Field Application Engineering for Axelera AI's Metis™ AI platform (Edge AI inference hardware) across Taiwan and APAC, supporting OEMs, integrators, and end users in industrial automation, automotive, and robotics.
Role type
Director, Field Application Engineering (Hardware/Embedded Systems)
Builds
Edge AI inference solutions using PCIe boards and compute modules for industrial automation, smart vision, automotive, and robotics.
Domain
Semiconductor hardware, Edge AI, Embedded Systems, Industrial Automation
Deliverable
production ML models | product features
Required skills
Embedded board design, chip-down development, custom carrier board design, ARM-based SoCs, high-speed digital interfaces, signal integrity, power sequencing, thermal design, embedded Linux, BSP bring-up, hardware/software integration debugging, AI accelerators/NPUs/GPUs
Preferred skills
Embedded AI/computer vision workloads, Yocto/Buildroot/Debian embedded Linux, PCIe enumeration/MSI/DMA, production validation, manufacturing bring-up, thermal/power optimization
Technologies
Metis™ AI Platform, PCIe, ARM SoCs, embedded Linux, Voyager SDK, PCIe boards, compute modules
Responsibilities
Lead hardware bring-up, board integration, and embedded system debugging; Drive pre-sales engagement and design wins; Build FAE processes and manage/regional team; Surface customer feedback to Product/R&D; Partner with Sales/BD on product introductions
Seniority
Director, regional leadership & hands-on technical engagement
