Senior Hardware Test Engineer - Micro-Soldering / PCB ECO (On-site. West Lafayette, USA)
Core
Perform ultra-fine micro-soldering, PCB rework, and functional testing to validate and debug brain-inspired wearable computing devices.
Role type
Senior Hardware Test Engineer (Micro-Soldering & PCB ECO)
Builds
Wearable and implantable devices using Wi-R non-radiative near-field communication technology
Domain
Deep tech / Wearables / Low-power IoT / RF-sensitive hardware
Deliverable
Production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Micro-soldering (0201), BGA rework, SMT repair, Oscilloscope usage, Logic analyzer usage, Hot-air tool operation, Reflow oven operation, Root-cause troubleshooting
Preferred skills
Wearable device experience, Low-power IoT systems, RF-sensitive hardware, AOI, X-ray inspection, Boundary scan
Technologies
Wi-R, SMT, BGA, AOI, X-ray, Boundary scan
Responsibilities
Perform micro-soldering and re-balling on 0201 components and smaller; Execute hardware ECOs and manage lab tools; Run functional tests and diagnostics using scopes and analyzers; Stress test devices and capture failure logs; Collaborate with hardware engineers to feed feedback into design iterations
Seniority
Senior, hands-on IC