Senior Optical Packaging Engineer  

CPO Architecture & Packaging Co-Design Design and development of packaging architectures for co-packaged optics, including integration of photonic devices, ASICs, and interposers. Develop scalable optical assembly processes, including alignment tolerances, passive/active alignment strategies, and manufacturability trade-offs. Work closely with photonics, electronics, and system teams to co-optimize packaging, signal integrity, power delivery, and thermal performance. Collaborate with Tier-1 suppliers and ecosystem partners to realize packaging solutions and drive technology towards production readiness. Build and evaluate prototypes, identify key failure modes, and iterate designs based on measurement data and system-level constraints. Master's or PhD's degree in Electrical Engineering, Photonics, Materials Science, or a related field. Ability to operate effectively in a multi-disciplinary environment. Experience in advanced semiconductor packaging (e.g., FCBGA, 2.5D/3D integration). Familiarity with hyperscale data center interconnect requirements. Experience working with external manufacturing partners or Tier-1 suppliers. Track record of delivering packaging solutions from concept to prototype or production. Background aligned with leading CPO practitioners (e.g., industry or research experience similar to co-packaged optics leaders).