Principal Engineer, Advanced Cooling Engineering
Core
Lead advanced thermal management strategy and roadmap for next-generation AI data center infrastructure, focusing on direct-to-chip liquid cooling and facility-scale cooling systems.
Role type
Principal Engineer, Advanced Cooling Engineering (Hands-on technical leadership)
Builds
End-to-end power and thermal management solutions for AI data centers and mission-critical applications
Domain
Data Center Infrastructure / Thermal Engineering / Liquid Cooling
Deliverable
production ML models | product features | infrastructure
Required skills
Fluid dynamics, heat transfer, thermal/fluid simulation, mechanical reliability, material compatibility, pump and manifold design, rack/server thermal design, high-density data center cooling expertise
Preferred skills
Direct-to-chip liquid cooling experience, CDU design, facility-level cooling strategy, multidisciplinary team leadership from concept to commercialization
Technologies
CDUs, rear-door heat exchangers, hot-aisle containment, secondary fluid networks
Responsibilities
Define multi-generation cooling roadmap across rack, row, hall, and facility levels; Lead applied R&D and prototype development for high-heat-flux cooling solutions; Develop integrated thermal management strategy connecting rack, facility, and controls; Partner with Systems Architecture for concurrent design of thermal, power, and IT infrastructure; Establish design standards and validation requirements for scalable liquid cooling platforms; Support customer-facing technical reviews with hyperscalers and partners; Drive manufacturability, reliability, and cost optimization practices
Seniority
Principal, hands-on technical leadership