Yield and Integration Engineer
Core
Collects, tracks, and analyzes process and metrology data to guide design and process yield improvement activities, with direct involvement in device failure analysis.
Role type
Yield and Integration Engineer
Builds
High-reliability sensors and imaging solutions for aerospace, defense, and industrial markets
Domain
Semiconductor manufacturing and failure analysis
Deliverable
production ML models | product features | dashboards & analysis
Required skills
Semiconductor wafer processing, Python, Matlab, R, JMP, SQL, Statistical Process Control (SPC), Structured problem-solving (Kepner Tregoe, DMAIC, 8D, 6-sigma), Design of Experiments (DOE/ANOVA), Optical microscopy, SEM/FIB, Profilometry, ellipsometry, X-Section, wafer stress, elemental analysis (TOF-SIMS, EDX, Auger), fault isolation techniques (FIBedit, OBIRCH/TIVA, IR, curve trace)
Preferred skills
Wafer processing (photo, etch, dep, clean, CMP, inspection), Vacuum technology, Infrared Imaging, Hermetic packaging (solder, seam seal, wirebond, WLP, die attach, leak testing)
Technologies
Python, Matlab, R, JMP, SQL
Responsibilities
Collect and analyze process and metrology data from various sources, track yield metrics, perform device failure analysis, collaborate with cross-disciplinary teams
Seniority
Mid-level, hands-on IC
