Sr. Mechanical Engineer, RF Payloads - TeraWave
Core
Mechanical design and packaging of high-power-density RF payload hardware for a multi-orbit satellite constellation, with thermal performance as a primary design driver.
Role type
Senior IC mechanical engineer (RF payload packaging & thermal management)
Builds
Optically interconnected satellite constellations for enterprise-grade global connectivity
Domain
Aerospace / Satellite Communications / RF Hardware
Deliverable
production ML models | product features
Required skills
mechanical design and packaging of complex electronic hardware, thermal management of high-power-density electronics, structural and thermal analysis (FEA), GD&T and engineering drawing standards, PLM and configuration management, 3D CAD modeling
Preferred skills
phased array mechanical integration, transient and cycled thermal design, heat pipe integration into structural hardware, spacecraft-level thermal architecture, design for high-rate production, DFM/DFT with contract manufacturers
Technologies
3D CAD tools, finite element tools, Windchill, Teamcenter
Responsibilities
Own mechanical design and packaging of phased array antenna panels and RF payload assemblies; Drive thermal management strategy for high-power-density RF electronics; Design PCBA mounting and retention approaches; Lead architecture and trade studies for packaging; Perform and interpret structural and thermal analysis; Own mechanical interface definition for RF payload units; Support structural and thermal test campaigns; Provide technical direction to suppliers and manufacturing partners; Mentor engineers on RF payload packaging and thermal-mechanical design practice
Seniority
Senior, hands-on IC
