Principal Technical Program Manager – FEIC ASIC Development – TeraWave
Core
Lead the full product lifecycle of Front-End Integrated Circuit (FEIC) chipsets for TeraWave's mm-wave phased array satellite communications network, from architecture definition through tapeout and production.
Role type
Principal Technical Program Manager (ASIC/RFIC)
Builds
mm-wave FEIC chipsets and phased array payloads for satellite communications
Domain
Aerospace & Defense / RFIC / Semiconductor
Deliverable
production ML models | product features | infrastructure
Required skills
Technical program management, RF/mixed-signal semiconductor development, vendor coordination, technical risk identification, analog/RF system planning
Preferred skills
Millimeter-wave RFIC architecture, Antenna-in-Package co-design, RF CMOS/SOI or BiCMOS processes, satellite communications qualification
Technologies
mm-wave, IF-to-RF conversion, LNAs, PLLs, mixers, RF CMOS/SOI, BiCMOS
Responsibilities
Drive parallel development of FEIC chipsets from architecture to production, build integrated schedules across design vendors, coordinate architecture trades and frequency planning, mitigate vendor and design risks, align FEIC specs with antenna integration, oversee post-silicon bring-up and qualification, manage multi-variant mask planning
Seniority
Principal, hands-on IC program leadership
