NPI Manufacturing Engineer (SMT process, PCBA,DFA))
Core
Perform Design for Assembly (DFA) analysis, drive non-compliance closure, and develop new backend manufacturing processes for new product mechanical assembly.
Role type
NPI Manufacturing Engineer (Mechanical Assembly & SMT)
Builds
New product mechanical assemblies and backend manufacturing processes
Domain
Consumer electronics manufacturing (Motorola Solutions)
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Mechanical assembly process, assembly jig/fixture design, poka-yoke design, Design for Assembly guidelines, statistical tools (pFMEA, SPC, DOE), ultrasonic welding, resistance welding, heat staking, vacuum leak test troubleshooting, SMT process for Flex and PCBA, SMT DFM
Preferred skills
Experience in SMT process for Flex and PCBA, Experience in SMT DFM process
Technologies
Ultrasonic welding, resistance welding, heat staking, vacuum leak test, SMT, pFMEA, SPC, DOE
Responsibilities
Perform DFA analysis for new product mechanical assembly, drive closure of mechanical assembly or process related issues with Design Engineering and suppliers, develop new backend processes/technology, develop suppliers for best-in-class manufacturing processes, troubleshoot product mechanical failures, optimize new product manufacturing processes
Seniority
Mid-level, hands-on IC