College Intern - Job Description Metrology, Defect Inspection, and Data Analytics for Die-to-Wafer Hybrid Bonding
Core
Develop and validate overlay metrology and defect inspection applications for a die-to-wafer hybrid bonding cluster system.
Role type
Intern, semiconductor equipment engineering
Builds
Die-to-wafer hybrid bonding cluster systems
Domain
Semiconductor manufacturing equipment
Deliverable
production ML models
Required skills
metrology, defect inspection, data analysis, image processing, software development, scripting, technical reporting
Responsibilities
Support metrology and defect inspection application development and testing; Analyze measurement and inspection data to evaluate system performance; Develop scripts and software tools for data processing, visualization, and automation; Apply image processing techniques for defect analysis and characterization; Prepare technical reports and collaborate with cross-functional engineering teams.