College Intern - Job Description Metrology, Defect Inspection, and Data Analytics for Die-to-Wafer Hybrid Bonding
Core
Develop and validate overlay metrology and defect inspection applications for a die-to-wafer hybrid bonding cluster system.
Role type
Intern, semiconductor equipment engineering
Builds
Die-to-wafer hybrid bonding cluster systems
Domain
Semiconductor manufacturing equipment
Deliverable
production ML models | product features
Required skills
metrology, defect inspection, data analysis, image processing, software development, scripting, technical reporting
Responsibilities
Support metrology and defect inspection application development and testing; Analyze measurement and inspection data to evaluate system performance; Develop scripts and software tools for data processing, visualization, and automation; Apply image processing techniques for defect analysis and characterization; Prepare technical reports and collaborate with cross-functional engineering teams.