Electrical Engineer II – Semiconductor Equipment
Core
Designing, modifying, and troubleshooting electrical assemblies, layouts, schematics, and drawings for next-generation 300 mm wafer-level substrate processing equipment.
Role type
Junior IC electrical engineer (semiconductor equipment)
Builds
300 mm wafer-level substrate processing equipment
Domain
Semiconductor manufacturing equipment
Deliverable
production ML models | product features
Required skills
electrical architecture definition, power distribution concepts, tool interlock and safety systems, high-level I/O and control system definitions, system-level design reviews, hazard analyses, subsystem integration, technical documentation
Preferred skills
semiconductor equipment experience, system-level architecture definition
Technologies
PLC, sensors, interlocks
Responsibilities
Define electrical architecture for 300 mm processing equipment, Develop power distribution concepts, Develop tool interlock and safety systems (SEMI S2 alignment), Develop high-level I/O and control system definitions, Support system-level design reviews and hazard analyses, Interface with mechanical, systems, and vendor teams on subsystem integration
Seniority
Junior, hands-on IC