Applications Engineer – 3D X-ray Systems
Core
Applications Engineer supporting semiconductor failure analysis labs, R&D centers, and academic institutions with advanced 3D X-ray systems for research and industrial applications.
Role type
Applications Engineer (3D X-ray Systems)
Builds
Repeatable workflows, new application use cases, and optimized imaging/analysis workflows for 3D X-ray technology.
Domain
Semiconductor manufacturing, materials science, X-ray imaging, failure analysis
Deliverable
product features
Required skills
Designing and conducting experiments, analyzing and communicating results, system demonstrations, customer training delivery, tool characterization, baseline performance evaluation, technical sales support, conference presentation, technical publication writing
Preferred skills
Microscopy or related imaging techniques background, commercial customer-facing system demonstration experience, X-ray absorption principles understanding, imaging/optical fundamentals knowledge
Technologies
3D X-ray systems, microscopy, imaging systems
Responsibilities
Conduct system demonstrations for prospective customers, Develop new applications and use cases for 3D X-ray technology, Contribute to defining and refining product specifications based on application insights, Deliver customer training on system operation, workflows, and data analysis, Develop and optimize imaging and analysis workflows, Perform tool characterization and baseline performance evaluations
Seniority
Individual Contributor, mid-level technical role