CMP Equipment Engineer
Core
Monitor and maintain wafer fabrication equipment, qualify new tools, and implement yield enhancement solutions in semiconductor manufacturing.
Role type
Equipment Engineer (Semiconductor Manufacturing)
Builds
Wafer fabrication processes and equipment reliability for semiconductor devices
Domain
Semiconductor manufacturing / Chemical Mechanical Polishing (CMP)
Deliverable
production ML models | product features | dashboards & analysis | infrastructure
Required skills
Equipment troubleshooting, Python/VBA scripting, Statistical analysis, Change Point Management, Lean/TPS/5S principles, 8D/7-step problem solving, SOP development, Cost reduction project management
Preferred skills
None stated
Technologies
Spotfire, JMP, Matlab
Responsibilities
Monitor wafer fabrication equipment and respond to issues, Qualify new manufacturing equipment, Coordinate equipment scheduling and downtime, Analyze data to identify processing trends, Adjust equipment parameters and monitor post-maintenance processes, Execute in-line changes to process or equipment, Revise Standard Operating Procedures, Develop improved processes to increase capabilities, Monitor operations costs and develop cost reduction projects
Seniority
Mid-level, hands-on IC