ChipFab Product Engineer

Malaysia-Penang B 1 & 2Full-time2026-10-26 → 2026-11-10

Core

Lead the ramp-up of new semiconductor facilities and manage the transition of products from NPI to High-Volume Manufacturing (HVM) for Indium Phosphide (InP) chips.

Role type

Senior IC Product Engineer (Semiconductor Manufacturing)

Builds

Backend InP wafer processing lines and chips for mass production

Domain

Semiconductor manufacturing, specifically Indium Phosphide (InP) backend processing

Required skills

Backend InP wafer processing, New facility ramp-up, Cross-functional team leadership, Yield stabilization, JMP statistical analysis, Equipment qualification, Process costing, Root cause analysis

Preferred skills

Bar processing (Stacker/unstack, Scribe & Break, AOI, Pick & Place), Remote team management

Technologies

JMP, Contract Manufacturing (CM) partner management systems

Responsibilities

Lead new facility and production line ramp-ups, Qualify new equipment and processes, Drive NPI to HVM transition, Monitor and improve production yields, Resolve daily engineering and quality issues, Conduct on-site quality audits at partner facilities, Manage product costing and cost reduction initiatives

Seniority

Senior, hands-on IC with leadership

About Broadcom

Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.