Reliability Engineer
Core
Reliability Engineer performing qualification support for Broadcom's leading edge Silicon and Packaging solutions, including board design review, thermal verification, and stress testing.
Role type
Senior IC Reliability Engineer
Builds
Hardware qualification data and stress test plans for new ASIC and packaging products
Domain
Semiconductor / Hardware Engineering
Required skills
Reliability qualification stress tests, HTOL/HTS/TC/THB/uHAST/bHAST, Schematic design and PCB layout review, Thermal head simulation, Automated Test Equipment (ATE), Electrical bench test setup and debug, Project schedule management
Preferred skills
AI tool development for complex tasks, JEDEC/Mil-Std stress test standards, Micro Control Company (MCC) HTOL experience, Biased HAST equipment experience, IC Chip Design background
Technologies
MCC HTOL, AEHR Test Sonoma HTOL, Biased HAST Equipment, HTOL systems
Responsibilities
Board hardware schematic and layout review, Thermal head simulation and design review, Liaise between external vendors and internal Business Units, Convert HTOL vectors to run on in-house MCC HTOL systems, Provide technical engineering support for the REL Lab team, Board and socket debug for setup or vector issues, Complete initial biased stress certifications, Develop biased and unbiased stress testing plans, Manage biased stress project schedules, Ensure REL project completion to meet qualification expectations
Seniority
Senior, hands-on IC
