Mechanical Engineer
Core
Lead thermo-mechanical lab operations and design high-power system enclosures with liquid cooling infrastructure for next-generation switch platforms.
Role type
Senior IC mechanical engineer (thermal systems & enclosure design)
Builds
High-power system-on-chip (SoC) reference and validation systems for datacenter switch platforms
Domain
Semiconductor hardware / Datacenter infrastructure
Deliverable
production ML models | product features
Required skills
Thermo-mechanical system design, liquid cooling infrastructure, BGA socket thermal validation, heatsink/vapor chamber/heat pipe design, thermal test planning & execution, vendor management for thermal components, rack-mount enclosure design, EMI/EMC compliance design, global contract manufacturer collaboration, high-speed cabling design and routing
Preferred skills
Knowledge of datacenter rack standards (EIA-310, OCP), exposure to compliance and reliability testing (NEBS, shock/vibration, thermal cycling)
Technologies
PTC Creo, Windchill PLM
Responsibilities
Lead thermo-mechanical lab operations including liquid cooling infrastructure and system-level testing; Own thermo-mechanical system component validation and troubleshooting; Develop and qualify advanced thermal solutions through vendor collaboration; Conduct system-level thermal tests and correlate results with simulations; Design rack-mount enclosures and system components based on production requirements; Manage vendor relationships for thermal solution components; Troubleshoot and resolve system-level thermal issues in high-power prototypes
Seniority
Senior, hands-on IC