Director of Client Development – Design‑Build & EPC Capital Projects (Semiconductor)
Core
Build, secure, and execute large-scale capital programs ($100M+) for semiconductor manufacturing clients, focusing on design-build (DB) and engineer-procure-construct (EPC) initiatives for wafer fabrication, advanced packaging, and support facilities.
Role type
Director, Client Development (Semiconductor Design-Build & EPC)
Builds
Multi-project capital programs for semiconductor manufacturing, cleanroom, sub-fab, and process utility facilities
Domain
Semiconductor manufacturing, Advanced Manufacturing, Construction (AEC)
Required skills
Capital program leadership, Semiconductor manufacturing operations expertise, Cleanroom classifications, Process tool integration, Sub-fab infrastructure, Process utilities management, Multidisciplinary team leadership, Commercial strategy, Contract negotiation, Risk management, Executive stakeholder engagement
Preferred skills
Wafer fabrication experience, Advanced packaging experience, MBA, PMP, Professional Engineer (PE) license
Technologies
Cleanroom systems, Process utilities (UPW, specialty gases), Automation systems, Manufacturing support systems
Responsibilities
Own bookings targets and pricing strategy for DB/EPC initiatives, Engage client executive stakeholders to align capital investment with capacity expansion, Lead pursuit strategy and executive presentations, Lead internal subject matter experts to deliver integrated solutions, Participate in pipeline governance and forecasting, Serve as executive sponsor for client satisfaction and account profitability
Seniority
Director, Strategic Client Leadership