Sr. Thermal Mechanical Engineer
Core
Design and develop thermal management solutions for high-density computing infrastructure, including direct-to-chip cooling, cold plates, rack-level cooling, and immersion cooling systems.
Role type
Senior IC thermal mechanical engineer (data center cooling)
Builds
Thermal management systems for AI servers, HPC platforms, and GPU/accelerator systems
Domain
Data center infrastructure / High-performance computing
Required skills
Direct-to-chip cooling design, cold plate design, rack-level cooling, CDU integration, immersion cooling, chip-to-chiller architectures, thermal cycling analysis, vibration/shock analysis, pressure cycling analysis, HALT/HASS test planning, environmental stress testing, coolant compatibility assessment, corrosion mitigation, filtration design, contamination control, leak detection, sealing strategy, long-term reliability risk assessment, manufacturing technology knowledge, supplier management, design review, tooling qualification, process qualification, cost reduction, production ramp support
Preferred skills
Technical leadership, complex design project management, supplier-facing experience
Technologies
AI servers, HPC platforms, GPU/accelerator systems, power electronics, high-density data center infrastructure
Responsibilities
Lead complex design projects for thermal management systems, design and validate cooling architectures for high-density computing, conduct environmental stress testing and reliability analysis, manage supplier relationships for design reviews and production ramp, assess manufacturing technologies and long-term reliability risks
Seniority
Senior, hands-on IC
