Research Associate (High Temperature-Resistant & Miniaturized Payload Hardware Design)
Core
Design and prototype a compact, heat-resistant multi-sensor payload (SLAM) capable of operating in extreme environments up to 250°C while maintaining internal electronics below 55°C.
Role type
Hardware Research Associate (Thermal & Miniaturized Payload Design)
Builds
Compact, thermally protected sensor payloads for extreme environments
Domain
Robotics / Thermal Engineering / Embedded Systems
Deliverable
production ML models | product features | physical/clinical work
Required skills
Mechanical CAD, thermal simulation, miniaturized hardware integration, heat-resistant enclosure design, embedded design, IP65/IP67 standards, fanless computing, high-temp materials
Preferred skills
Fire-fighting robot experience, harsh-environment robotic platforms
Technologies
ANSYS, SolidWorks
Responsibilities
Design compact mechanical housing for 250°C ambient conditions, select and integrate miniaturized components, perform heat simulation and shock-resistance design, test hardware in specified environments
Seniority
Mid-level, hands-on IC
