Technical Sales & Applications Program (TSAP) – Field Application Engineer, Entry Level
Core
Early-career development program for new graduates to become Field Application Engineers (FAEs) supporting NXP's Global Sales in Industrial, IoT, and Automotive markets.
Role type
Entry-level Field Application Engineer (FAE) trainee
Builds
NXP semiconductor solutions (MCU/MPU, Wireless, Security) for customers in Industrial, IoT, and Automotive sectors
Domain
Semiconductor, Embedded Systems, Automotive, Industrial IoT
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Embedded systems knowledge, Microcontroller/Processor selection, C/C++/Python programming, Schematic and PCB review, Lab validation and debugging, Technical presentation and training, Cross-functional collaboration
Preferred skills
ARM-based embedded systems, RTOS/Linux development, Robotics software, Motor control, Sensor integration, Edge AI, Embedded security
Technologies
MCU/MPU, ARM, RTOS, Linux, C, C++, Python, UART, SPI, I2C, CAN, USB, Ethernet, Oscilloscopes, Power analyzers
Responsibilities
Provide technical leadership to sales teams and customers on NXP portfolio; Lead proof of concept development, product evaluations, and debug activities; Design support through schematic and PCB reviews; Prepare and deliver technical presentations and training materials; Collaborate with sales, marketing, and engineering teams; Represent NXP technology at customer meetings and industry activities
Seniority
Entry-level, structured learning program transitioning to permanent FAE role
