Global OSAT Operation Engineering
Core
Provide technical leadership for yield, quality, reliability, and productivity improvement programs across OSAT sites while driving manufacturing excellence and supply assurance.
Role type
Senior IC OSAT Operation Engineering Manager
Builds
Semiconductor assembly and packaging solutions for global clients
Domain
Semiconductor manufacturing (OSAT)
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Yield improvement, quality management, manufacturing productivity enhancement, project management, leadership, stakeholder management, root cause analysis, change management (PCN), subcontractor management, package qualification, Safe Launch execution, process control methodologies (DOE, SPC, FDC), reliability qualification
Preferred skills
Advanced packaging technologies (WLCSP, FOWLP, Cu Pillar Bumping, Flip-Chip), mainstream semiconductor packages (QFN, LQFP, wire bond), AI/ML deployment, predictive analytics, automated defect detection, manufacturing digitalization, Smart Factory initiatives, Industry 4.0
Technologies
AI/ML, predictive analytics, automated defect detection, FDC, SPC, DOE
Responsibilities
Lead OSAT site transfer, second-source qualification, and capacity expansion projects; Review and approve subcontractor 8D, CQC, Safe Launch reports, PCN submissions, and corrective/preventive action plans; Lead supplier technical assessments, capability benchmarking, and readiness reviews; Lead onsite root cause investigations and resolution of major quality incidents and yield excursions; Champion Smart Factory initiatives by working with OSATs on AI/ML deployment and manufacturing digitalization; Provide regular executive updates on qualification status, supply risks, and strategic OSAT initiatives
Seniority
Senior, hands-on IC with management responsibilities