-搶先投遞- 高雄/台北 2027 學生實習計畫
Core
Internship program for 2027 covering semester and summer terms, focusing on engineering, quality, supply chain, and finance roles.
Role type
Intern
Builds
Test platforms, semiconductor packaging processes, quality verification, failure analysis, production capacity, AI agents, wireless test cases, financial reports, supply chain plans.
Domain
Semiconductor manufacturing, wireless communications, finance, supply chain management
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Test platform setup, test program development, test data analysis, semiconductor packaging process research, product quality validation, failure analysis using instrumentation, hardware development, production capacity planning, AI agent implementation, AI model validation, process automation, dashboard building, wireless communication testing, financial accounting, supply chain planning, cross-functional communication
Preferred skills
Graduate student status, English proficiency (TOEFL/IELTS/TOEIC), experience in research institutes
Technologies
AI Agent, AI models, Dashboard, Bluetooth, WIFI
Responsibilities
Setup test platforms and develop test programs, analyze test data and generate reports, research semiconductor packaging processes, validate product quality and analyze data, analyze chip failure causes using instruments, develop and improve hardware projects, plan and analyze production capacity, implement AI agents and validate models, build dashboards, test wireless communication cases, handle financial and accounting tasks, plan and manage supply chain, communicate product quality with external vendors
Seniority
Intern