DCP Equipment Engineering Intern - Summer 2027
Core
Summer engineering internship focused on troubleshooting production equipment and process issues within a semiconductor wafer manufacturing facility.
Role type
Summer Engineering Intern (Semiconductor Manufacturing)
Builds
Multi-million dollar production equipment and semiconductor manufacturing processes
Domain
Semiconductor manufacturing / Wafer fabrication
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
problem-solving, self-motivation, initiative, cross-functional collaboration
Preferred skills
Mechanical, Materials Science, Chemical, or Electrical Engineering background
Technologies
semiconductor manufacturing equipment, factory operations systems
Responsibilities
troubleshoot production equipment and process issues, drive real projects related to Safety, Quality, Delivery, and Cost metrics, optimize equipment maintenance and repair, present results to senior management
Seniority
Intern