CMP Equipment Engineer
Core
Support and improve Chemical Mechanical Polishing (CMP) equipment performance, reliability, and uptime in a high-volume semiconductor wafer fabrication environment.
Role type
Equipment Engineer (CMP)
Builds
Semiconductor manufacturing output and reliability
Domain
Semiconductor manufacturing / Wafer fabrication
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
CMP equipment troubleshooting, root cause analysis, preventive maintenance planning, equipment qualification, SPC, cleanroom operations, cross-functional collaboration
Preferred skills
Applied Materials Mirra/Messa tool experience, Screen DNS/Ontrak Scrubber experience, data analysis (JMP, Spotfire, Python, MATLAB, SQL, VBA), structured problem-solving (8D, DMAIC, 5-Why), Lean Manufacturing, Six Sigma, TPM
Technologies
Applied Materials Mirra, Mirra Messa, Screen DNS AS2000, Ontrak Scrubber Systems, NovaScan System 2040, JMP, Spotfire, Python, MATLAB, SQL, VBA
Responsibilities
Monitor and maintain CMP equipment to meet output and reliability targets; troubleshoot equipment failures and coordinate recovery actions; perform root cause analysis on recurring issues; support equipment qualifications, installations, and upgrades; develop and optimize preventive and predictive maintenance plans; partner with Process Engineering to drive yield and productivity improvements; analyze equipment and process data to identify trends and variation sources; support process experiments and qualification activities; investigate process excursions and implement corrective actions.
Seniority
Mid-level IC (2–5 years experience)