Senior FA Engineer
Core
Perform high-precision sample preparation and failure analysis on semiconductor packages and dies using advanced imaging and etching tools.
Role type
Senior IC failure analysis engineer (semiconductor)
Builds
Diagnostic insights for package-level and die-level electrical and physical failures
Domain
Semiconductor manufacturing and R&D
Deliverable
physical/clinical work
Required skills
die extraction, layer-by-layer polishing, chemical processing, RIE operation, SEM/EDX operation, backside IR analysis, cross-sectioning, wire bonding, repackaging, ion polishing
Preferred skills
Wafer Fab experience, knowledge of emerging semiconductor technologies
Technologies
SEM, EDX, RIE, X-Prep, MIP, ion polishing systems
Responsibilities
Operate precision milling/polishing and RIE systems for site-specific sample preparation; execute die extraction and layer-by-layer polishing; conduct chemical processing and repackaging; document analysis results with observations and corrective actions; contribute to developing new FA techniques and tool evaluation projects
Seniority
Senior, hands-on IC
