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Engineering Execution Manager, HIG High Bandwidth Memory (HBM)

Boise, ID - Main Site💼 Full-time🗓 2026-07-24 → 2026-09-26

Core

Guide High Bandwidth Memory (HBM) products through concept, build, NPI, and HVM phases by facilitating multi-functional life-cycle management and tactical execution.

Role type

Engineering Execution Manager (Product Development)

Builds

HBM products for the semiconductor industry

Domain

Semiconductor / Memory and Storage

Deliverable

product features

Required skills

multi-functional team leadership, project prioritization, risk analysis, schedule management, cross-functional integration, hardware readiness assessment

Preferred skills

data analysis, data visualization, JIRA, Confluence, process improvement

Technologies

JIRA, Confluence

Responsibilities

Integrate HBM development across extended teams and partners; partner with Technology, Build, Process, and Manufacturing teams; collaborate with PMO to build and sustain development schedules; communicate development status and challenges; set tactical expectations; serve as product point of contact; consolidate inputs for hardware readiness.

Seniority

Manager, hands-on IC

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