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MGR, F16N DF PEE

Miaoli - Tongluo, Taiwan💼 Full-time🗓 2026-05-19 → 2026-07-31

Core

Maximizes yield by working on tools, the process, or wafer fabrication recipes; troubleshoots wafer fabrication problems and performs root cause analysis.

Role type

Senior IC process engineering manager (semiconductor fabrication)

Builds

High-performance DRAM, NAND, and NOR memory and storage products

Domain

Semiconductor manufacturing / Wafer fabrication

Deliverable

production ML models | product features | infrastructure

Required skills

Wafer fabrication recipe development, root cause analysis, process deviation control, defect investigation, process adjustment, yield maximization

Preferred skills

Shift engineering collaboration, long-term defect investigation, process improvement recommendation

Technologies

Wafer fabrication tools, process control systems

Responsibilities

Troubleshoot wafer fabrication problems, perform root cause analysis, evaluate products to ensure design and performance specifications, conduct research to assess process adjustment requirements, recommend process improvements

Seniority

Manager, hands-on IC

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