Intern - Assembly Equipment Engineer
Core
Enhance Non-Stick On Pad (NSOP) detection and alarm logic in the Wire Bond (WB) process to enable early identification of bond stick failure, reduce unscheduled downtime, and prevent extended production impact.
Role type
Intern, Assembly Equipment Engineer
Builds
Improved NSOP alarm systems and standardized failure criteria for Wire Bond machines
Domain
Semiconductor manufacturing / Equipment Engineering
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Electrical Engineering, Manufacturing Engineering, Semiconductor Engineering, Mechanical Engineering, Mechatronics Engineering
Preferred skills
Alarm logic design, UAT execution, Pilot run management, Data collection and trend analysis, Correlation of alarm data with bond parameters
Technologies
Wire Bond machines, NSOP alarm systems, UAT environments
Responsibilities
Define and standardize NSOP failure criteria in WB process, Improve NSOP alarm logic for early detection, Collaborate with EE and Manufacturing Engineers to align alarm thresholds, Execute UAT and pilot run on selected WB machines, Collect NSOP event data for downtime and failure trend analysis
Seniority
Intern