Senior Engineer, NTI Metrology
Core
Developing and deploying X-ray metrology models and techniques for advanced 3D NAND process technologies to enable robust process control and device ramp.
Role type
Senior IC metrology development engineer (semiconductor)
Builds
3D NAND process technologies and metrology solutions for Micron
Domain
Semiconductor manufacturing / 3D NAND / X-ray metrology
Deliverable
production ML models | product features
Required skills
X-ray metrology techniques (XRF, XRR, XRD, SAXS, X-ray CD, tomography), SEM metrology modeling, materials characterization, data analysis, equipment operation and troubleshooting, process integration collaboration, Model-on-record (MOR) management
Preferred skills
Semiconductor device fabrication and characterization, statistical analysis, data science and machine learning
Technologies
XRF, XRR, XRD, SAXS, X-ray CD, X-ray tomography, SEM
Responsibilities
Develop Scattered-Electron-Microscope (SEM) metrology models and drive understanding of new metrology technology; Demonstrate X-ray metrology techniques for new nodes to enable robust process control; Identify solutions for inline detection of buried or high-aspect-ratio structures using non-destructive X-ray methods; Integrate X-ray and SEM data to explain electrical failed signatures at probe; Collaborate on technology choices and translate device needs into equipment roadmap requirements; Maintain Model-on-record (MOR) accuracy for successful technology ramp; Influence supplier equipment roadmap for next-generation X-ray metrology solutions
Seniority
Senior, hands-on IC