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OMT RAM RDA Process Optimization Engineer

Taichung - Fab 16, Taiwan💼 Full-time🗓 2026-07-02 → 2026-07-30

Core

Using process and defect simulation methodologies to identify defect root causes and enable process window optimization in semiconductor manufacturing.

Role type

Process Optimization Engineer (Semiconductor Yield Engineering)

Builds

High-performance DRAM, NAND, and NOR memory and storage products

Domain

Semiconductor manufacturing / Yield engineering

Deliverable

production ML models | product features

Required skills

Process defect root cause analysis, process simulation modeling, manufacturing data analysis, statistical problem-solving (FA, FMEA, DOE, SPC, 8D), cross-functional technical communication

Preferred skills

Advanced process/physical modeling and simulation tools (TCAD, statistical modeling), yield modeling, defect density analysis, semiconductor change management, risk assessment

Technologies

TCAD, process simulation tools, statistical modeling software, inline metrology systems, defect inspection tools

Responsibilities

Develop and apply process/defect simulation models to understand defect generation mechanisms; Correlate simulation results with inline defect, EBI, process data, and yield indicators; Drive data-backed process optimization strategies to expand process windows; Perform what-if simulations to evaluate impact of process parameter changes; Partner with process, integration, and equipment engineers to translate insights into fab actions; Lead or support defect reduction, yield improvement, and cost reduction projects; Support new process introduction (NPI) and baseline qualification by assessing defect risks

Seniority

Mid-level to Senior, hands-on IC

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