ENGINEER, PRODUCT QE_PQA2 PARAM/WLR
Core
Lead Product Quality Engineering (PQE) and Wafer Level Reliability (WLR) programs to ensure DRAM/NAND memory reliability, manage MRB cases, and drive process improvements from NPI through HVM phases.
Role type
Senior IC Product Quality Engineer (Memory/Storage)
Builds
High-performance DRAM, NAND, and NOR memory products for data centers, AI, 5G, and mobile applications.
Domain
Semiconductor manufacturing and memory storage
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Semiconductor device physics, DRAM product specification, statistical data analysis, root cause analysis (8D/FMEA), failure analysis, CMOS/silicon memory device knowledge, reliability mechanisms, process flow understanding, quality metrics monitoring
Preferred skills
Wafer level burn-in monitoring, RMA management, ASSM event management, NPI/HVM program development, global quality dashboard analysis, team leadership, performance management
Technologies
DRAM, NAND, NOR memory, CMOS, silicon-based memory devices, MRB systems, RMA systems, OQRM, FMEA, 8D processes
Responsibilities
Manage MRB cases and postmortems for CAPA enhancement; monitor wafer level burn-in and shift left to probe; manage RMA analysis for process improvement; develop WLR and PARAM programs for fab process reliability; oversee outgoing quality control for wafer surface and pad defects; lead new product management and customer sample delivery; drive quality metrics improvements including OQRM and RMAs; monitor global quality dashboards and report reliability metrics; lead team performance objectives, training plans, and quality culture advocacy.
Seniority
Senior, hands-on IC with team leadership
