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[Fab15 HVM] - Dry Etch Process Equipment Engineer

Hiroshima - Fab 15, Japan💼 Full-time🗓 2026-03-17 → 2026-09-26

Core

Establishing mass-production technology and managing production for advanced DRAM semiconductor products via dry etch processes.

Role type

Senior IC process equipment engineer (semiconductor manufacturing)

Builds

High-performance DRAM memory chips for data centers, AI, 5G, and mobile applications

Domain

Semiconductor manufacturing / Memory and storage solutions

Deliverable

production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work

Required skills

Problem-solving, project coordination, cross-functional collaboration, data analysis, equipment troubleshooting, process optimization, shift management, technical reporting, standardization, international technical exchange

Preferred skills

Physics/chemistry/mechanical/electrical fundamentals, Microsoft Office proficiency, safety compliance, self-management

Technologies

Dry etch equipment, mass production systems, shift scheduling tools

Responsibilities

Improve yield rates and management systems, enhance productivity, support new equipment installation and modification, identify and resolve mass-production issues with product teams, lead improvement activities with technicians and other engineers, report on daily issues and long-term projects, participate in global technical exchanges for standardization

Seniority

Senior, hands-on IC

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