HBM 招募專區｜加入 MTB，站上 AI 與先進記憶體最前線
Core
Operating and maintaining HBM manufacturing equipment, automation systems, and processes to ensure stable production and yield in a high-volume semiconductor environment.
Role type
HBM Manufacturing Equipment & Process Engineer (Shift)
Builds
HBM memory modules for AI, GPU, and HPC applications
Domain
Semiconductor manufacturing, Advanced Packaging, High-Performance Computing
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Semiconductor equipment maintenance, Troubleshooting, Process monitoring, Data analysis, Root cause analysis, Cleanroom operations, Shift work adaptability
Preferred skills
Bachelor's degree in STEM, Experience with 3D stacking/TSV, Knowledge of IATF/ISO standards, English proficiency
Technologies
OHT, OHS, Stockers, BWS, Sorters, ASRS, PCVD, Dry Etch, Photo, WET, CMP, SPC, Inline Defect Inspection
Responsibilities
Perform daily maintenance and troubleshooting of HBM production equipment, Monitor and optimize critical processes (PCVD, Dry Etch, etc.) using data analysis, Conduct failure analysis (PFA/EFA) and identify root causes, Collaborate with cross-functional teams for preventive maintenance and system improvements, Execute manufacturing processes and monitor tool status, Prepare system operation and maintenance reports
Seniority
Entry to Mid-level, Hands-on IC