Staff, Principal, TLP Engineer, Advanced Modeling & AI Solutions
Core
Lead the design and deployment of agentic and LLM-powered modeling solutions for semiconductor process, package, and manufacturing workflows.
Role type
Staff/Principal Technical Lead Engineer (AI/ML for Semiconductor)
Builds
Agentic AI systems, digital twins, and production ML pipelines for semiconductor design and manufacturing.
Domain
Semiconductor manufacturing, physics-based modeling, AI/ML
Deliverable
production ML models
Required skills
Physics-based modeling, Machine Learning, Large Language Models (LLMs), Agentic AI systems, MLOps, Cloud platforms (AWS/GCP/Azure), PyTorch, TensorFlow, RAG, RLHF, Data storytelling
Preferred skills
Semiconductor domain expertise, Agentic frameworks (LangGraph, AutoGen), Knowledge Base/Ontology development, Cross-functional leadership
Technologies
PyTorch, TensorFlow, AWS, GCP, Azure, LangGraph, AutoGen, AgentEval
Responsibilities
Design and deploy physics-based, ML, and LLM-powered modeling solutions; Architect agentic AI systems for digital twin development; Define best practices for production LLM deployment; Evaluate and improve model performance; Translate modeling results into insights via data storytelling.
Seniority
Staff/Principal, hands-on IC with strategic leadership
