CareerPlan

Member of Technical Staff, NAND Advanced Thin Films Process Development

Fab 10N/X, SingaporeFull-time2026-04-06 → 2026-11-11

Core

Lead project-level initiatives for structural and electrical film processes (dielectric, Carbon-based) in NAND memory technology, performing experiments, material characterization, and process integration.

Role type

Senior IC process development engineer (NAND thin films)

Builds

NAND memory technology processes and structures

Domain

Semiconductor manufacturing / Memory storage

Required skills

Thin film deposition (ALD, CVD), Metrology (ellipsometry, XRR, SEM, TEM), Process integration, Defect analysis, Statistical process control (SPC), Design of experiments (DOE), Root cause analysis, Technology transfer

Preferred skills

Publications or patents in thin film domains, Multi-functional collaboration, Project-level leadership

Technologies

ALD, CVD, Ellipsometry, XRR, SEM, TEM, CD-SEM

Responsibilities

Lead development of structural and electrical film processes; Carry out complex experiments and support process integration; Maintain accurate records and prepare technical reports; Mentor early-career staff; Support continuous improvement and optimization; Participate in multi-functional problem-solving teams; Contribute to SOP development and knowledge management.

Seniority

Senior, hands-on IC