ENGINEER - F15 MFG CMP Equipment Engineer
Core
Leading the design, development, and characterization of new CMP bond process tools to identify and resolve hardware and procedural gaps.
Role type
Senior IC equipment engineer (CMP process tools)
Builds
Semiconductor manufacturing equipment (CMP tools)
Domain
Semiconductor manufacturing / Chemical Mechanical Polishing
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Analytical problem solving, Technical communication and training, Programming skills, Database understanding, Digital skills (Script, RPA, Tableau), Time management, Multitasking, Microsoft Office proficiency
Preferred skills
None stated
Technologies
Script, RPA, Tableau, Microsoft Office (Excel, Word, PowerPoint)
Responsibilities
Launching CMP bond process tools, Ensuring all safety training is completed and adhering to Micron safety policies, Leading design and development of new equipment, Supervising equipment installation and upgrades while managing quality, cost, and schedule, Collaborating with equipment vendors for product improvement and roadmap realization, Creating and maintaining documentation on equipment performance, operating procedures, maintenance specs, and cost metrics, Responding to internal and external audits
Seniority
Senior, hands-on IC