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HVM PEE WP PR ENG

Hiroshima - Fab 15, Japan💼 Full-time🗓 2025-12-18 → 2026-07-31

Core

Maintain semiconductor production line health and optimize wet process equipment for particle removal and film stripping in wafer manufacturing.

Role type

Process and Equipment Engineer (Wet Process)

Builds

High-performance DRAM, NAND, and NOR memory and storage products

Domain

Semiconductor manufacturing / Wet process engineering

Deliverable

production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work

Required skills

Process condition development, process capability improvement, process management project establishment, semiconductor device parameter setup, new equipment/material evaluation, anomaly analysis and improvement

Preferred skills

Problem-solving, analytical skills, cross-functional collaboration, time management, multi-tasking

Technologies

Wet process equipment, chemical solutions, gases, steam, semiconductor wafers

Responsibilities

Develop and improve process conditions and technologies; Enhance process capability and reduce production costs; Establish and correct process management projects; Set up process parameters in diverse semiconductor devices; Evaluate new equipment/materials for production deployment; Analyze and improve upon anomalies

Seniority

Entry to Mid-level, hands-on IC

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